SOLDER (Sn95Pb5)
Physical Properties :
TIN BASED SOLDER (95/5)
SPECIFICATIONS
Other Impurities Within Specified Limits
Elements
Specification(%)
Tin (Sn)
94.5%-96.5%
Lead (Pb)
BALANCE
Antimony (Sb)
0.50 Maximum
Silver (Ag)
0.015 Maximum
Copper (Cu)
0.08 Maximum
Cadmium (Cd)
0.001 Maximum
Aluminum (Al)
0.005 Maximum
Bismuth (Bi)
0.25 Maximum
Arsenic (As)
0.03 Maximum
Iron (Fe)
0.02 Maximum
Zinc (Zn)
Applications:
SOLDER (Sn90Pb10)
TIN BASED SOLDER (90/10)
89.5%-91.5%
SOLDER (Sn80Pb20)
TIN BASED SOLDER (80/20)
79.50 % - 80.50 %
0.15 Maximum
SOLDER (Sn70Pb30)
TIN BASED SOLDER (70/30)
69.5%-71.5%
0.025 Maximum
Applications: Used for coating or pre-tinning before soldering.
SOLDER (Sn63Pb37)
TIN BASED SOLDER (63/37)
62.5%-63.5%
Applications: Used in the stained glass industry, in electronic components such as computers and communications equipment.
SOLDER (Sn60Pb40)
TIN BASED SOLDER (60/40)
59.5%-61.5%