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Solder Alloys

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Technical Specification ( Solder Alloys )


Solder(Sn95Pb5) | Solder(Sn90Pb10) | Solder(Sn80Pb20)
Solder(Sn70Pb30) | Solder(Sn63Pb37) | Solder(Sn60Pb40)
 
 

SOLDER (Sn95Pb5)

 

Physical Properties :

Melting Point :- 360˚C TO 620˚C / 680 F TO 1148 F
Appearance :- Silver To Gray
 

TIN BASED SOLDER (95/5)

SPECIFICATIONS

Other Impurities Within Specified Limits

Elements

Specification(%)

Tin (Sn)

94.5%-96.5%

Lead (Pb)

BALANCE

Antimony (Sb)

0.50 Maximum

Silver (Ag)

0.015 Maximum

Copper (Cu)

0.08 Maximum

Cadmium (Cd)

0.001 Maximum

Aluminum (Al)

0.005 Maximum

Bismuth (Bi)

0.25 Maximum

Arsenic (As)

0.03 Maximum

Iron (Fe)

0.02 Maximum

Zinc (Zn)

0.005 Maximum

Applications:

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SOLDER (Sn90Pb10)

 

Physical Properties :

Melting Point :- 360˚C TO 620˚C / 680 F TO 1148 F
Appearance :- Silver To Gray
 

TIN BASED SOLDER (90/10)

SPECIFICATIONS

Other Impurities Within Specified Limits

Elements

Specification(%)

Tin (Sn)

89.5%-91.5%

Lead (Pb)

BALANCE

Antimony (Sb)

0.50 Maximum

Silver (Ag)

0.015 Maximum

Copper (Cu)

0.08 Maximum

Cadmium (Cd)

0.001 Maximum

Aluminum (Al)

0.005 Maximum

Bismuth (Bi)

0.25 Maximum

Arsenic (As)

0.03 Maximum

Iron (Fe)

0.02 Maximum

Zinc (Zn)

0.005 Maximum

Applications:

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SOLDER (Sn80Pb20)

 

Physical Properties :

Melting Point :- 360˚C TO 620˚C / 680 F TO 1148 F
Appearance :- Silver To Gray
Density :- 7640 Kg / m3 OR 0.276 Lb / in3
 

TIN BASED SOLDER (80/20)

SPECIFICATIONS

Other Impurities Within Specified Limits

Elements

Specification(%)

Tin (Sn)

79.50 % - 80.50 %

Lead (Pb)

BALANCE

Antimony (Sb)

0.50 Maximum

Silver (Ag)

0.15 Maximum

Copper (Cu)

0.08 Maximum

Cadmium (Cd)

0.001 Maximum

Aluminum (Al)

0.005 Maximum

Bismuth (Bi)

0.25 Maximum

Arsenic (As)

0.03 Maximum

Iron (Fe)

0.02 Maximum

Zinc (Zn)

0.005 Maximum

Applications:

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SOLDER (Sn70Pb30)

 

Physical Properties :

Melting Point :- 183˚C TO 190˚C / 361 F TO 374 F
Density :- 7910 Kg / m3 OR 0.285 Lb / in3
 

TIN BASED SOLDER (70/30)

SPECIFICATIONS

Other Impurities Within Specified Limits

Elements

Specification(%)

Tin (Sn)

69.5%-71.5%

Lead (Pb)

BALANCE

Antimony (Sb)

0.50 Maximum

Silver (Ag)

0.015 Maximum

Copper (Cu)

0.08 Maximum

Cadmium (Cd)

0.001 Maximum

Aluminum (Al)

0.005 Maximum

Bismuth (Bi)

0.25 Maximum

Arsenic (As)

0.025 Maximum

Iron (Fe)

0.02 Maximum

Zinc (Zn)

0.005 Maximum

Applications: Used for coating or pre-tinning before soldering.

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SOLDER (Sn63Pb37)

 

Physical Properties :

Melting Point :- 183˚C / 361 F
Density :- 8190 Kg / m3 OR 0.296 Lb / in3
 

TIN BASED SOLDER (63/37)

SPECIFICATIONS

Other Impurities Within Specified Limits

Elements

Specification(%)

Tin (Sn)

62.5%-63.5%

Lead (Pb)

BALANCE

Antimony (Sb)

0.50 Maximum

Silver (Ag)

0.015 Maximum

Copper (Cu)

0.08 Maximum

Cadmium (Cd)

0.001 Maximum

Aluminum (Al)

0.005 Maximum

Bismuth (Bi)

0.25 Maximum

Arsenic (As)

0.03 Maximum

Iron (Fe)

0.02 Maximum

Zinc (Zn)

0.005 Maximum

Applications: Used in the stained glass industry, in electronic components such as computers and communications equipment.

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SOLDER (Sn60Pb40)

 

Physical Properties :

Melting Point :- 183˚C TO 190˚C OR 361 F TO 374 F
Density :- 8525 Kg / m3 OR 0.308 Lb / in3
 

TIN BASED SOLDER (60/40)

SPECIFICATIONS

Other Impurities Within Specified Limits

Elements

Specification(%)

Tin (Sn)

59.5%-61.5%

Lead (Pb)

BALANCE

Antimony (Sb)

0.50 Maximum

Silver (Ag)

0.015 Maximum

Copper (Cu)

0.08 Maximum

Cadmium (Cd)

0.001 Maximum

Aluminum (Al)

0.005 Maximum

Bismuth (Bi)

0.25 Maximum

Arsenic (As)

0.03 Maximum

Iron (Fe)

0.02 Maximum

Zinc (Zn)

0.005 Maximum

Applications: Used in the stained glass industry, in electronic components such as computers and communications equipment.

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